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Wire-Wound Surface Mount Inductors
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 4.7 μH ±15% [FP3-4R7-R]; 169-9586
Eaton Bussmann SeriesTHÔNG SỐ KỸ THUẬT Inductance 4.7 μH Maximum DC Current 4.2A Package/Case FP3 Length 7.25mm Depth 6.7mm Height 3mm Dimensions 7....
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 4.7 μH ±15% [FP3-4R7-R]; 770-0476
Eaton Bussmann Series.THÔNG SỐ KỸ THUẬT: Inductance 4.7 μH Maximum DC Current 4.2A Package/Case FP3 Length 7.25mm Depth 6.7mm
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 3.3 μH ±15% [FP3-3R3-R]; 169-9584
Eaton Bussmann SeriesTHÔNG SỐ KỸ THUẬT Inductance 3.3 μH Maximum DC Current 5.5A Package/Case FP3 Length 7.25mm Depth 6.7mm Height 3mm Dimensions 7....
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 3.3 μH ±15% [FP3-3R3-R]; 770-0467
Eaton Bussmann Series.THÔNG SỐ KỸ THUẬT: Inductance 3.3 μH Maximum DC Current 5.5A Package/Case FP3 Length 7.25mm Depth 6.7mm
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 15 μH ±15% [FP3-150-R]; 169-9582
Eaton Bussmann SeriesTHÔNG SỐ KỸ THUẬT Inductance 15 μH Maximum DC Current 2.5A Package/Case FP3 Length 7.25mm Depth 6.7mm Height 3mm Dimensions 7.2...
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Cooper Bussmann Flat-Pac 3 Series Type FP3 Wire-wound SMD Inductor with a Composite Iron Powder Core, 15 μH ±15% [FP3-150-R]; 770-0451
Eaton Bussmann Series.THÔNG SỐ KỸ THUẬT: Inductance 15 μH Maximum DC Current 2.5A Package/Case FP3 Length 7.25mm Depth 6.7mm